Corporate Vice President & Chief
Technology Officer
Motorola Semiconductor Product Sector
Barry C. Johnson is Corporate Vice President and Chief Technology Officer for the Semiconductor Products Sector of Motorola, Inc. Dr. Johnson is responsible for the Sector’s worldwide technology strategy and is Director of the DigitalDNATM Laboratories, the Sector’s 1100 member central research and development organization. With 1999 sales of $7.4 billion, Motorola’s Semiconductor Products Sector is the world’s largest producer of embedded processors.
Dr. Johnson joined Motorola in 1991 as Director of the Advanced Packaging Development Center, the Semiconductor Product Sector’s strategic microelectronic packaging research laboratory. Since that time, he has assumed positions of increasing responsibility within the Sector. In 1993, he was appointed Vice President and Director of Manufacturing Technology Development for the Microprocessor and Memory Technologies Group. In this assignment, he had responsibility for development of advanced integrated circuit manufacturing technologies and was architect of Motorola’s industry pioneering 300mm wafer program. In 1997, he was promoted to Vice-President and Director of Global New product and Technology Operations for the Semiconductor Components Group, where he oversaw all technology and product development organizations. In 1998, he was elevated to his current position.
Before joining Motorola, Dr. Johnson worked at the DuPont Corporation in Wilmington, Delaware as a Senior Research Fellow in the Central Research Laboratory, and Manager of the Fundamental Research Group in the Electronics Department. Prior to DuPont, he was Professor of Electrical and Computer Engineering at the University of Arizona in Tucson, Arizona, where his principal research interests included advanced integrated circuit packaging interconnection methods, electronic materials, and transport phenomena in thin films.
A native of Philadelphia, Pennsylvania, Dr. Johnson received his B.S. Degree in Mechanical Engineering from Villanova University, Villanova, Pennsylvania, and his M.S. and Ph.D. Degrees in Metallurgical Engineering and Materials Science from Carnegie-Mellon University, Pittsburgh, Pennsylvania. He holds eight patents and has authored over sixty technical papers.
Major awards include the Anderson Prize, the Villanova University Professional Achievement Award, the University of Arizona Outstanding Faculty Award, and the 1994 National Black Engineer of the Year Award.
Multilevel Metallization Systems
Since the inception of the integrated circuit, a major limitation to performance and reliability has been the robustness of the interconnect metallization system. The intent of the talk is to show how research at CMU in the 1070s played a significant role in understanding the fundamental, causal mechanisms.