Through-Polymer Etching Experiment

Cross-sectional view of 6 micron thick PDMS film over patterned silicon wafer. Xenon difluoride diffused through polymer to silicon.

Etching parameters: 30 cycles of 3 Torr XeF2, each cycle lasting 60 seconds.

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Cross-sectional view with PDMS removed after through XeF2 etching.

Etching parameters: 12 cycles of 3 Torr XeF2, with each cycle time lasting 10 minutes