ELKHART, Ind.--(BUSINESS WIRE)--May 21, 1999--CTS Corp. (NYSE:CTS) today announced that its custom microcircuits manufacturing operation, CTS Microelectronics, located in West Lafayette, Ind., has been awarded a contract by Harris Corp. ASD, Melbourne, Fla., to provide three custom optical data link multichip modules (MCMs) in support of the F-22 Raptor Aircraft. The CTS MCMs include a Fiber Optic Transmitter(Tx) and Receiver (Rx) pair, used to provide high bandwidth (400 Mb/sec) point-to-point communications within the F-22 airframe, and a High Speed Data Bus (HSDB), which provides high rate bus communications in support of the Tx and Rx devices. The contract award is the result of CTS' design and development activity begun with Harris Corp. in 1993. CTS Microelectronics designed and developed the three unique multichip modules, selecting low temperature cofired ceramic (LTCC) for the multilayer interconnect network, as well as a unique detachable fiber optic connector -- integral with the package. This design approach allows replacement of only the optical link cable to the multichip module in the event of damage to the optical cable, thereby saving Harris the cost of replacing the complete MCM. The award is for support of two F-22 production representative test vehicle (PRTV) aircraft, as well as additional modules for the continued testing of this application. Additional details of the contract award were not released. Delivery is scheduled to begin in third quarter 1999. CTS Microelectronics is a turn-key designer and manufacturer of custom microcircuits and a world leader in the manufacture of LTCC networks, providing "packaging solutions" to customers. In this case, the CTS design accomplished significant savings in size and weight -- both of which are extremely important in aircraft applications. For additional news on CTS Corp., visit our website at www.ctscorp.com...Home Page...What's New. CTS Corp., listed on the New York Stock Exchange, (NYSE:CTS), is primarily a diversified manufacturer of electronic components and custom assemblies principally for the communications equipment, computer equipment, and automotive markets. The Company, headquartered in Elkhart, Ind., operates manufacturing plants in the United States and abroad.  