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From: japanese@netcom.com (Jack Bernstein)
Subject: Japanese LC Manufacturing
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In late 1994, ED Research, a respected technology research
firm that specializes in flat panel displays, released the
results of a survey/site visits of the 10  leading
manufacturers of liquid crystal displays. They had
unprecedented access  to the technology and to the
engineers that manage it. The results published in  a
report entitled Full Details of the Japanese LC
Manufacturing Line. That 120-page document has now
been translated into English and is being made available
to U.S. and European corporations.

Full Details looks at the Japanese companys:

- Cost analysis of components and processes
- Future plans for line modification and new processes
- Strategies for manufacturing
- Facility set-up costs
- Cost analysis by technology
- Projections of component and manufacturing costs
- Details and evaluations of FPT manufacturing equipment
- The outlook for phase 3 production methods.

For information about how to acquire this report, contact:

David Andrews
InterLingua
japanese@aol.com
310/792-3636
fax 310/792-3642

Following is the table of contents

Chapt. 1  General Discussion

1. Trends in TFT LCD

a). Shifts in TFT Panel Pricing
b). Color STN
c). Trends in Panel Size
d). Standardization of Glass Substrates
e). Production Volume of TFT

2. Strategies of TFT Manufacturers

a). Sharp
b). NEC
c). Toshiba
d). Hoshiden
e). Hitachi Manufacturing
f). Fujitsu
g). Mitsubishi Electric
h). Matsushita Electric Appliances
i). Sanyo Electric
j). Casio Calculators
* Production, Technology, and Sales for the 10 Major Panel 
Manufacturers

Chapt. 2  TFT Panel Cost Analysis

Basis 1. for Cost Analysis

Basis 1 Process Method
a). NSi Method
b). ISi Method
c). Panel Assembly and Modules

Basis 2. Facility Setup of the TFT Manufacturing Process

a). NSi Method
b). ISi Method

Basis 3. Material Expenses

a). Color Filter
b). Drive IC and Controller
c). Glass Substrate
d). Backlight

Basis 4. Yield

Basis 5. Capital Returns on Facility

2. Cost Analysis

a). NSi Method, Second Stage Line in 1993
b). NSi Method, First Stage Line in 1995
c). NSi Method, First Stage Line in 1996
d). NSi Method, Second Stage Line in 1996
e). ISi Method, First Stage Line in 1993
f). ISi Method, Second Stage Line in 1996

3. Results of Statistical Cost Analysis

Appendix: Schematic Diagram of Chapter 2

Chapt. 3  Outlook for the Third Stage Production Line

1. Market, Product Trends, Line Image
2. Projection of the Required Number of Lines and Demand for 
Facilities
3. Projection of Demand for Facilities beyond 1995

Chapt. 4  Trends in Manufacturing Equipment and Specifications

1. Ranking of Manufacturing Equipment Producers

a). Rapid Recovery in 1993
b). Profile of the Top 10 Makers

2. Developments in Major Equipment

a). Plasma CVD Device

Nichiden Anerba, Applied Komatsu Technology
Tokyo Electron, 
Kokusai Denki, ULVAC Japan Ltd.

b). Light Filter Device

Canon, Nikon

c). Dry Etching Device

Tokyo Electron, Plasma System, Reiboldt, ULVAC Japan 
Ltd.

d). Sputtering Device

ULVAC Japan Ltd., Nichiden Anerba, Reiboldt

e). Photoprocessing Related Device

Dainippon Screen Mfg. Co., Ltd., Tokyo Electron, 
HAMATECH, Chuou Riken

f). Cleaning Device

Shibaura Mfg. Co., Shimada Rika Kogyo, Dainippon 
Screen Mfg. Co., Ltd.

g). Ion Doping Device

Nissin Electric

h). Defect Inspection Device

Hitachi Electronic Engineering, Hugle Electronics, Laser 
Tech, 
Japan Fellow Full Idex, KLA Acrotech, Orbotech

i). TFT Electrical Property Inspection Device

Terradine, IBM, Tokyo Electron/Genrad, Photon Dynamics


