Professor - stress-strain in materials, infrared thermographic stress analysis, fatigue damage mechanisms, fracture control, micromechanics of solder joints, composite materials; <A HREF="http://www.engr.wisc.edu/consortia/cmei/">Consortium for Mesomechanics of Electrical Interconnects</A>; <A HREF="http://www.engr.wisc.edu/interd/msep/msep.html">Manufacturing Systems Engineering Program</A>; <A HREF="http://www.engr.wisc.edu/centers/wsmtl/">Wisconsin Structures and Materials Testing Laboratory</A><P>
