Newsgroups: comp.robotics
Path: brunix!sgiblab!swrinde!gatech!udel!MathWorks.Com!yeshua.marcam.com!charnel!rat!zeus!rhowe
From: rhowe@harp.aix.calpoly.edu (Richard B Howe)
Subject: Re: L293D...
Message-ID: <1994Feb20.161840.128848@zeus.aix.calpoly.edu>
Sender: news@zeus.calpoly.edu
Organization: California Polytechnic State University, San Luis Obispo
References: <CLFECJ.7t3@ecf.toronto.edu>
Date: Sun, 20 Feb 1994 16:18:40 GMT
Lines: 9

The object is to get heat out of the chip as quickly and effecently as
possible.  While you do want to mount the heatsink directly on the
body of the chip to get the heat out of the package, it is the chip
inside that is generating the heat.  Since the metal pins are better
heat conductors than the plastic package, it is also desirable to make
good thermal contact to the heatsink with them.  Electricly these pins
are also ground since that would be a good choice for the heatsink.

Rich
