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From: nrd1jxz@nrd.ups.com (Joe Zheng)
Subject: Conference in Beijing
Message-ID: <Cn6EEy.2xJ@nrd.ups.com>
Organization: United Parcel Service
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Date: Thu, 24 Mar 1994 15:44:57 GMT
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INTERNATIONAL CONFERENCE ON ELECTRONICS AND INFORMATION TECHNOLOGY
                   Friendship Hotel, Beijing, China,
                         August 3 - 5, 1994. 

                          CALL FOR PAPERS

General Chairs:
Wu Youshou 
Professor of Tsinghua University, 
Beijing, China

George Bugliarello 
Member of US National Academy of 
Engineering
President of Polytechnic University, 
NY, USA

Organizing Chair:
C. Julian Chen
IBM T.J. Research Center
P.O. Box 218
Yorktown Heights, NY 10598
juchen@watson.ibm.com
Phone: (914) 945-2935
Fax: (914) 945-2141

Program Chair:
Hong Liu
Univ. of Massachusetts Dartmouth
Dion-302D
North Dartmouth, MA 02747
liu@cis.umassd.edu
Phone: (508) 999-8502
Fax: (508) 999-8901

Exhibition Chair:
Phillip Y. Ong
AT&T Bell Labs, Room HO 2L-416
101 Crawfords Corner Road
Holmdel, NJ 07733
weng@goofy.ho.att.com
Phone: (908) 949-6783
Fax: (908) 949-0194

Fiance Chair:
Wenmin Pan
New Jersey Institute of Technology
Newark, NJ 07102

Registration Chai:
MengChu Zhou
New Jersey Institute of Technology
Newark, NJ 07102


Advisory Committee:
F. DiCesare, T. Fukuda, Y. C. Ho, B.W. Lu, 
H. Mouftah, S. Panwar, T. J. Tarn, Z. Sha, 
J. M. Tien

The conference is jointly sponsored by the Chinese Institute 
of Electronics (CIE) and the Chinese-American Society of 
Electronics and Information Technology (CASEIT). Its co-sponsorship
is provided by several organizations including Ministry of 
Electronics Industry, China, Chinese Academy of Sciences. It provides 
an international forum for the presentation and discussion of 
research and application development in the field of electronics 
and information technologies. The conference offers all 
interested businesses and professionals with opportunities to 
understand and develop international market, particularly, in 
China and the United States in the areas of electronics and 
information technology, establish business partnership and 
collaboration on research and application development. It enables 
effective and systematic technology exchange among researchers, 
managers, engineers from academic, industry, and government.
	Authors are invited to submit papers solicited in, but not 
limited to, the following areas: 
Information technology & applications; wireless communications; 
intelligent networks; high-speed networking (LAN, MAN, WAN); 
network modeling, analysis, and design; 
image processing technology and applications; 
multi-media technology and applications; HDTV; Systems Integration 
electronic devices, software developing environment; 
Computer aided design/manufacturing/engineering (CAD/CAM/CAE); 
industrial automation and control; advanced management in transportation;
IVHS, semiconductor manufacturing, Database design and applications.

	Submit 5 copies of abstract (no more than 200 words) along 
with 1 camera copy (following the given format, you can request it from 
above-mentioned Chairs for a copy or LaTex version from Dr. Zhou at
zhou@ece.njit.edu) of the full paper to the  
program chairperson at the above address. All submissions 
should be accompanied by a cover letter containing a list of all 
the authors, their affiliation, telephone numbers, e-mail 
addresses, and facsimile telephone numbers.
	For exhibition information, contact the exhibition 
chairperson at the above address by March 1, 1994.
	For further information, contact the organizing 
chairperson at the above address.

IMPORTANT DATES
	First Announcemennt and Call for Papers: December 1993
	Second Announcemennt and Call for Papers: March 1994
	Deadline for paper submission:	April 15, 1994 (may extended to May 1)
	Notification of acceptance:	May 15, 1994
	Pre-registration: June 25, 1994
	Conference Dates: August 3-5, 1994

CONFERENCE LANGUAGE
	English

Please return the following form to 
C. Julian Chen, IBM T.J. Watson Research Center, P.O. Box 218, 
Yorktown Heights, NY 10598. 

Name: ____________ Affiliation: ______________________________
Address: _____________________________________________________ 
Zip: ________ E-mail/Fax: ___________ Phone: _________________
() I plan on submitting a paper on the following topic:	
______________________________________________________________
() I plan on presenting a demo on the following title:	
______________________________________________________________
() I am interested in receiving an advance program when available.

---------------------------------
Only the paper deadline is extended.
Mengchu

